The high frequency of electronic equipment is the development trend, especially with the increasing development of wireless networks and satellite communications, information products are moving towards high speed and hi...
RogersRO4350B is a hydrocarbon/ceramic laminate with a dielectric constant of 3.48. It meets the requirements of commercial grade equipment manufacturers for printed circuit boards.Requirements for printed circuit boards...
The IC test substrate (probe card) is a test interface, which mainly tests the bare core by connecting the tester and the chip, and testing the chip parameters by transmitting signals. The main purpose of the probe card ...
LGA package carrier board featuresHigh Density Junction StructureVia Fill Plating and Stacked Via StructuresVarious surface treatmentsHigh requirements for sheet and surface flatnessLGA package carrier board using proces...
BGA package carrier board features:High Density Junction StructureVia Fill Plating and Stacked Via StructuresVarious surface treatmentsHigh requirements for sheet and surface flatnessBGA package carrier board using proc...
The trend of PCB design is to develop in the direction of thinness and lightness. In addition to high-density circuit board design, there is an important and complex field such as the three-dimensional connection assembl...
The birth and development of FPC and PCB gave birth to new products of Rigid-Flex PCB. Therefore, the combination of a flexible circuit board and a rigid circuit board is a circuit board with FPC characteristics and PCB ...
The definition of HDI (High Density Intrerconnection) circuit board refers to the microvia (Microvia) with the hole diameter below 6mil, the hole ring diameter (Hole Pad) below 0.25mm, the contact density above 130 point...
The two-stage HDI board has a staggered hole structure and a laminated structure. The so-called staggered hole means that the two layers of laser holes are staggered. Why stagger it? Because the copper plating is not sat...