LGA package carrier board featuresHigh Density Junction StructureVia Fill Plating and Stacked Via StructuresVarious surface treatmentsHigh requirements for sheet and surface flatnessLGA package carrier board using proces...
BGA package carrier board features:High Density Junction StructureVia Fill Plating and Stacked Via StructuresVarious surface treatmentsHigh requirements for sheet and surface flatnessBGA package carrier board using proc...